• 2019 International Conference on Engineering Education and Innovation

    Seoul, South Korea; September 21-23, 2019

  • 2019 International Conference on Engineering Education and Innovation

    Seoul, South Korea; September 21-23, 2019

  • 2019 International Conference on Engineering Education and Innovation

    Seoul, South Korea; September 21-23, 2019

Welcome to ICEEI 2019- Engineering Education and Innovation!

2019 International Conference on Engineering Education and Innovation (ICEEI 2019) is an optimal platform for academic communications, exchange of ideas and inspirations between specialists and scholars in the fields of education and innovation, including hot issues such as vocational education, applied psychology, innovation economy and innovative research.

2019 International Conference on Engineering Education and Innovation (ICEEI 2019) will take place in Seoul, South Korea during September 21-23, 2019, sponsored by Seoul National University.

Publication & Indexing

After a careful reviewing process, all accepted papers after proper registration and presentation, will be published in the Conference Proceedings, which will be included in the major database, Ei Compendex and Scopus, etc.

We recognizes that not every paper will necessarily contain new theoretical results or new algorithms, and encourages the submissions that provide a thorough review of models and analyses that are validated through implementation and experimentation. We will make every effort to fairly review papers with a systematic manner.

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Important Date

Submission Deadline: May 15, 2019

Acceptance Notification:  June 05, 2019

Registration Deadline: June 20, 2019

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Submission Methods

Papers submitted via the Electronic Submission System. Feel free to contact us via iceei2019@zhconf.ac.cn if you encounter any problem when submit a paper.

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Files Download

Dowload Paper Template

Download Conference Flyer

Listener's Registration Form

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Latest News

November 28, 2019 News! ICEEI 2019 will be held in Seoul National University during September 21-23, 2019. Welcome to attend!

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